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招募流程:
网申&在线测评——校园宣讲——笔试/面试——录用通知——加入西数
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西数更多招募活动,晶彩待续
申请职位列表【面向2018届&2017届毕业生招募】
R&D(研发) |
Senior Engineer, Reliability Engineering | |
Senior Engineer, Analytical & Characterization Engineering | |
Senior Engineer, Design Verification(MT) | |
Senior Engineer, Test Engineering(ST) | |
Senior Engineer, Product Design Engineering | |
Senior Engineer, Product Design Engineering | |
Senior Engineer, Product Design Engineering | |
Senior Engineer, Product Design Engineering | |
Senior Engineer, Product Design Engineering | |
Senior Engineer, Packaging Engineering | |
Senior Engineer, Packaging Engineering | |
Senior Engineer, Packaging Engineering | |
Senior Engineer, Packaging Engineering | |
Senior Engineer, Packaging Engineering | |
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Senior Engineer, Test Engineering(SSD) | |
1. Senior Engineer, ReliabilityEngineering高级可靠性测试工程师
Responsibilities:
Develop Memory Reliability Specifications
Develop reliability Characterization Plan
Develop Memory Qualification Plan
Execute Characterization and Qualification
Perform failure analysis, tracing root cause andcorrective actions
Develop reliability test scripts
Develop Data Analysis/Automation scriptscompatible with Big Data
Specify/procure/bring up Rel Test/Debug/dataanalysis Equipment
Work withFab/Device/Packaging/Design/Characterization/BUs/PETE/Quality to resolve issues
Requirements:
Master Degree in Microelectronics, Electronics/ElectricalEngineering, Computer Science, with adequate knowledge on semiconductorpackaging and testing process and technology.
NAND/NOR Flash memory knowledge is preferable
Good oral English and communication skills
Well understand reliability test mechanism andtypical failure phenomenon
Well understand reliability test spec/proceduredefined by JEDEC
Good programming skills: C++, Python, Big Data
Experience of text processing with python, Perl
1. Senior Engineer, Analytical &Characterization Engineering高级特征性测试分析工程师(芯片验证方向)
Responsibilities:
Test development and implementation for testingand characterization of NAND memory on ATE test systems.
In this role, the individual is responsible forall aspects of test debug and validation, correlation, revision control andtest/handler setup.
Perform characterization of all memory technologyand designs for logic/ functionality, performance, power consumption, timingand some aspects of reliability.
Work with corresponding teams for product issueresolution.
1. Senior Engineer, DesignVerification(MT) 高级设计验证工程师
Responsibilities:
In this position, the individual will assist inthe debugging and development of NAND KGD, BI and MT test programs for FLASHautomated test systems.
The ability to write correct, clean and well documentedprograms strictly according to design documents and data sheets.
Support and improve the full-automated test cellwith tester and device handler, developing characterization and evaluationprograms for new products and supporting failure analysis with productengineering.
The individual will also be responsible toco-work with various engineering departments to solve program and productissues.
When urgent needs arrive, the individual need tomeet the deadline as required.
1. Senior Engineer, PackagingEngineering高级封装研发工程师(核心工程—先进封装设备研发)
Responsibilities:
Process development on Molding, interactTechnology, Material & Equipment;
Interface of process, to communicate therequirement from inner/outer customers;
Recipe Baseline & design rule maintain;
Trouble shoot for Molding process;
Program management for new/upgrade process;
New Package development, qualification till VM,involve thru process & technology.
Requirements:
Master Degree;
Major in Material science / Semiconductor /Polymer / Assembly engineering
Familiar with Molding Process, Manufacturing flowand Quality control, Molding experience is preferred;
Familiar with tradition semiconductorpackaging/Assembly;
Skill of Static Analysis and Quality controltool;
Good to have program management skill;
Good English communication (written and verbal)skills;
Able to do international travel occasionally;
Self-motivated, teamwork, hardworking, and beable to work under high pressure.
2. Senior Engineer, TestEngineering(SSD) 高级测试工程师(固态硬盘)
Responsibilities:
TBD
Requirements:
TBD